Modeling of field penetration through planes in multilayered packages

56th Electronic Components and Technology Conference 2006, 2006

Multilayered packages and boards, such as high performance server boards, contain thousands of signal lines, which have to be routed on and through several layers with power/ground planes in between. There can be noise coupling not only in the transversal direction through the power/ground planes in such a structure, but also vertically from one plane pair to another through the apertures and via holes. In addition, the continuous increase in power demand along with reduced Vdd values results in significant current requirement for the future chips. Hence, the parasitic effects of the power distribution system become increasingly more critical regarding the signal integrity and electromagnetic interference properties of cost-effective high-performance designs. We present a multilayer finite-difference method (M-FDM), which is capable of characterizing such noise coupling mechanisms. This method allows to consider realistic structures, which would be prohibitive to simulate using full-wave simulators.

1996

 This paper presents an efficient signal integrity analysis technique for simulating voltage fluctuations on power/ground planes in complex packaging structures. With its unique circuit and electromagnetic field solvers, the value, the number and the location of the decoupling capacitor placed on packages or printed circuit boards can be quickly and effectively evaluated.

IEEE Transactions on Advanced Packaging, 2005

We introduce a model of simultaneous switching noise (SSN) coupling between the power/ground plane cavities through cutouts in high-speed and high-density multilayer packages and printed circuit boards (PCBs). Usually, the cutouts are used in multilayer plane structures to isolate the SSN of noisy digital circuits from sensitive analog circuits or to provide multiple voltage levels. The noise-coupling model is expressed in terms of the transfer impedance. The proposed modeling and analysis results are compared with measured data up to 10 GHz to demonstrate the validity of the model. It is demonstrated that the cutout is the major gate for SSN coupling between the plane cavities, and that substantial SSN coupling occurs between the plane cavities through the cutout at the resonant frequencies of the plane cavities. We also analyze and discuss the coupling mechanism and characteristics of the noise coupling, from which we evaluate a method of suppression of the SSN coupling. Proper positioning of the cutout and the devices at each plane cavity achieves significant noise suppression at certain resonant frequencies. The suggested suppression method of the SSN coupling was successfully proved by frequency domain measurement and time domain analysis.

53rd Electronic Components and Technology Conference, 2003. Proceedings.

Today's modeling methodologies for multi-layer power distribution systems do not take into account coupling between powedground plane pairs. If power/ground planes have cutout in them, substantial coupling may occur between plane pairs through the cutout. This coupling effect may increase the simulation error when high speed system which has cutout structures in their poweriground planes is to be analyzed. This paper presents analytical model which captures coupling effect through cutout in multi-layer powedground planes. Based on the model, the suppression method is discussed. According to the simulation results, the coupling noise through cutout can be successfully suppressed by placing the ports and cutouts at the proper locatious.

2006

Abstract—This paper describes a two-step technique for modeling the radiated electromagnetic emissions from a printed circuit board with attached cables when the source of the emissions is noise between the board's power and ground planes. The first step calculates the electric fields at the edges of the power-ground plane pair. The second step replaces the power plane with equivalent sources embedded within the ground plane structure.

Electronic …, 2004

Various noise suppression methods using embedded capacitor are analyzed and verified by frequency domain me;isuement and full wave simulation up to 10 GHz frequency range. In this paper, especially, the noise coupling suppression methods on split powerlground plane in the multi-layered packages are analyzed.

2001

Abstract The maximum coupling between printed circuit board components connected to the same power-ground plane pair often occurs at or near power bus resonances. Theoretically, the transfer coefficient, S 21, between two locations on the power bus can be as high as 0dB (ie perfect coupling) near resonant frequencies. However, in practice the coupling is usually much less due to losses in the power bus structure.

IEEE Transactions on Electromagnetic Compatibility, 2005

This paper presents a detailed design and modeling approach for power planes with integrated high-impedance electromagnetic surfaces (HIS). These novel power planes, which were introduced recently, have the unique ability of providing effective broadband simultaneous switching noise (SSN) mitigation. Fullwave electromagnetic simulation is used to study the impact of the geometry on the performance of these novel power planes. It is demonstrated that power planes using inductance-enhanced HIS can be designed for broadband mitigation of the SSN from the upper hundred megahertz to the gigahertz frequencies. Physicsbased compact models for the unit cell of power planes with integrated HIS are developed and several of them connected in a two-dimensional array to build full models for large and multilayer power planes. The compact model offers fast analysis of power planes. As an example, we show that the full-wave simulation time of a 10 × 10 cm power plane with integrated HIS can be dramatically reduced from 24 to 48 h using a commercially available three-dimensional full-wave solver to less than 1 min when using the compact circuit model developed here.

2002

This thesis describes the design of a high-density power distribution system. Properties of impedances of power distribution systems are examined. Impedances are classified as self and trans-impedances. These properties are then used to save simulation time, which is a big factor for power distribution system design. Time domain models are extracted for the test cases. A novel 2D-3D technique of placing decoupling capacitors is demonstrated that is based on the effectiveness of the capacitor at that location. The power distribution system acts as a cavity resonator supporting discrete modes that vary with distance. Each capacitor is placed at the physical location where it has maximum impact on corresponding system modes. Targeting the modes at the ports where they are dominant using decoupling capacitors reduces trans-impedances. This technique is extended to the entire surface of the power distribution system using just a single set of simulations. This thesis presents a novel 2D-...

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2011

In this paper, an efficient cascaded microwave network approach is presented for power and signal integrity analysis of multilayer printed-circuit boards (PCBs) and advanced electronic packages with multiple signal traces, multiple power-ground plates, multiple vias, and external loads such as decoupling capacitors. Each parallel-plate pair, which consists of two consecutive conductor plates functioning as either power or ground in the PCBs or packages, is modeled as one individual microwave network. Equivalent circuits are used in the microwave network to model the vias, and a parallelplate impedance matrix is formulated to account for the wave interactions between the vias and the boundary of the PCB or package. If signal traces are present in a plate pair, a modal decomposition and recombination approach is employed to model two associated modes: the transmission line mode for the signal traces, and the parallel-plate mode for the power-ground plate pair. The microwave networks for each plate pair are finally cascaded together by enforcing the continuity of the voltages and currents at the via clearance holes in the conductor plate shared by two consecutive plate pairs. Numerical validation reveals that the cascaded microwave network approach produces accurate simulation results with much less central processing unit time and memory requirements than 3-D full-wave approaches. Index Terms-Cascaded microwave network, electronic package, modal decomposition and recombination, power and signal integrity, via circuit model. I. INTRODUCTION I N ADVANCED high-speed electronic systems, thousands of interconnect elements-in term of power delivery network and signal link paths (SLP)-are often used to interface heterogeneous components such as processing units, memory Manuscript